Intel is going green with its next generation of powerful CPUs, removing lead from the manufacturing process and replacing it with new solder alloys.

Intel’s next generation of processors, built using the advanced and energy-efficient 45 nm technology and including high-k metal gates (Hi-k) will be completely free of lead, a toxic metal that once inside the human body affects the brains, the kidneys and the liver.

The Intel 45nm Hi-k family includes the next-generation Intel Core 2 Duo, Core 2 Quad and Xeon processors, and the company will begin 45nm Hi-k production in the second half of this year.

"Intel is taking an aggressive stance toward environmental sustainability, from the elimination of lead and a focus on greater energy efficiency of our products to fewer air emissions and more water and materials recycling," said Nasser Grayeli, Intel vice president and director of assembly test technology development, Technology and Manufacturing Group.

Intel stated in 2003 that high-k gate dielectrics may be introduced at the 45 nm node to reduce gate leakage current. However, chipmakers have since then voiced concerns about introducing these new materials into the gate stack.

Intel's 45nm processors not only are lead-free, they also make use of the company's Hi-k silicon technology for reduced transistor leakage, enabling more energy-efficient, high-performance processors. Using an undisclosed thick hafnium-based material for its high-k films in gate-stack applications, Intel claims that it is able to boost the overall performance, while also reducing transistor leakage by more than 10 times over current silicon dioxide technology. The company's 45nm Hi-k silicon technology also includes third-generation strained silicon for improved drive current and a lower interconnect capacitance using low-k dielectrics for increased performance and lower power. Ultimately, Intel's 45nm Hi-k family of processors will enable sleeker, smaller and more energy-efficient desktop, notebook PC, mobile internet device and server designs.

Intel has more than 15 45nm Hi-k product designs in various stages of development, and will have two 45nm manufacturing fabs in production by the end of the year, with a total of four in production by the second half of 2008 that will deliver tens of millions of these processors.

In 2002, Intel produced its first lead-free flash memory products. In 2004, the company began shipping products with 95 percent less lead than previous microprocessor and chipset packages.

To replace the remaining 5 percent (about .02 grams) of lead solder historically found in the first-level interconnect -- the solder joint that connects the silicon die to the package substrate -- in processor packages, Intel will use a tin/silver/copper alloy. It is the way in which Intel will implement these new materials to replace the tin/lead solder that is the "secret sauce" of the company's solution.